Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module

Product Details
Customization: Available
Function Type: Thermal Imaging System
Detection Type: Uncooled Vox Infrared Detector
Diamond Member Since 2024

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Exhibition Experience
The supplier had participated in offline trade shows, you can check the Audit Report for more information
Experienced Team
The supplier has 17 foreign trading staff(s) and 13 staff(s) with over 6 years of overseas trading experience
Multi-language Pioneer
2 languages freely used by foreign trade staff. include: English, Spanish
Importers and Exporters
The supplier has import and export rights
to see all verified strength labels (20)
  • Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
  • Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
  • Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
  • Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
  • Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
  • Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
Find Similar Products
  • Overview
  • Product Description
  • Product Highlights
  • Specifications
  • Application Scenarios
  • Company Information
  • FAQ
Overview

Basic Info.

Model NO.
Turing C256
Certification
RoHS
Pixel Pitch
12μm
Resolution
256×192
Frame Rate
25Hz
Brightness/Contrast Adjustment
Manual/Automatic
Polarity
Black-Hot/White-Hot
Palette
Support Multiple Types
Reticle
Display/Blank/Move
Mirror Image
Horizontal/Vertical/Diagonal
Power Supply Range
3.8V~5.2V
Weight
≤3.5g
Lens
2mm, 3.2mm, 7mm, 10mm, and 13mm
Extension Components
Analog Video
Specification
21× 14.6mm

Product Description

Product Description

Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
Turing C256 uncooled infrared module, adopting an advanced 256×192 wafer detector, features compact dimensions, lightweight design, and low power consumption, meeting the SWaP³ design requirements. The split assembly makes it more flexible to use. It comes with multiple auxiliary development tools that support multiple ARM architecture SOC platforms, ensuring ease of use and integration. It also supports the simultaneous output of images and temperature values with a variety of lightweight infrared lenses and extension components. As the best choice for low-cost solutions, this product series can be used in many scenarios such as industry, power, security protection, and machine vision.

Product Highlights

• Low-Cost Solution
It adopts the 256×192 WLP detector and weighs only 3.5g with a 3.2mm lens.
It supports multiple ARM architecture SOC platforms, capable of directly processing sensor data.

 
• Easy Development
It is compatible with various mainstream embedded SOC platforms and can optimize the image effect of ISP.
It provides multiple SDK development interfaces for rapid secondary development.

 
• Multiple Selections
The FOV varies from 20° to 90° and the extension supports multiple protocols such as DVP, MIPI, and analog video.
The split design is convenient for integration and development, supporting applications in multiple areas such as consumer, intelligence, security, and industrial sectors.
 

Specifications

model Turing C256
Performance Characteristics
Detector Type Uncooled VOx infrared detector
Resolution 256×192
Pixel Pitch 12μm
Frame Rate 25Hz
Spectral Band 8~14μm
NETD ≤50mK@25°C (≤40mK, optional)
Image Adjustment
Brightness/Contrast Adjustment Manual/Automatic
Polarity Black-hot/White-hot
Palette Support multiple types
Reticle Display/Blank/Move
Image Processing digital filtering noise reduction, and digital detail enhancement
Mirror Image Horizontal/Vertical/Diagonal
Power Supply
Power Supply Range 3.8V~5.2V
Power Consumption (Typical, @25°C, Without Extension) ≤0.35W
Interface
Digital Video CDS2/CDS3/LVCMOS
Serial Communication Interface UART
Extension Components Analog Video
Interface/Supporting
Direct Drive Solution Compatible with SOC platforms such as HIS13516, HIS13519, NT98528, AR9201, AR9341, and CV28M33
Temperature Measurement Characteristics
Temperature Measurement Range For temperature measurement series, -20ºC~+550ºC
Measurement Accuracy For temperature measurement series, ±3°C or ±3% at ambient temperature of -20°C~+60°C
Physical Characteristics
Dimensions (Without Lens and Extension Components) 21×14.6mm
Weight (3.2mm, Without Extension Components) ≤3.5g
Lens 2mm, 3.2mm, 7mm, 10mm, and 13mm
Environment Adaptability
Operating Temperature -20ºC~+60ºC
Storage Temperature -45ºC~+85ºC
Humidity 5~95%, non-condensing
Product Certification RoHS2.0

Application Scenarios

UAV                                                                           Security Monitoring
Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module

Industrial Temperature Measurement                                                             Machine Vision
Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module
 

Company Information

Swap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core ModuleSwap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core ModuleSwap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core ModuleSwap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core ModuleSwap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core ModuleSwap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core ModuleSwap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core ModuleSwap³ Uncooled Infrared Module 3.5g Split Assembly Thermal Imaging Camera Core Module

FAQ

Q1: How can we guarantee quality? 
A: We have professional infrared detector chip manufacturing, rigid thermal camera manufacturing process, perfect quality management system, CNAS certification reliability test platform.


Q2:How long is your delivery time?
A: For smal order,it usually takes 7 working days. For OEM order, please check the shipping time with us

Q3: What's the MOQ?
A: MOQ is depend on the product.

Q4: What's your payment terms?
A: Our payment terms is L/C, T/T, D/P, Western Union, Paypal and Money Gram.

Q5: What's the product warranty policy?
A: OEM products purchased from our company come with a 1-year warranty. Refer to the instructions for more details.


Q6: How about aftersale support?
A: We provide lifetime Technical Support, our engineer will respond your technical support within 24 hours.

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier